23 ?2009 littelfuse, inc. spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. esd/surge protection devices SP1003 lead-free/green series lead-free/green SP1003 description applications zener diodes fabricated in a proprietary silicon avalanche technology protect each i/o pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at 25kv (contact discharge, iec 61000-4-2) without performance degradation. additionally, each diode can safely dissipate 7a of 8/20s surge current (iec61000-4-5) with very low clamping voltages. SP1003 lead-free/green series rohs pb green features t & 4 %
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25kv contact, 30kv air t & ' 5
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" (5/50ns) t - j h i u o j o h
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7a (8/20s) t - p x m f b l b h f d v s s f o u p g 1a (max) at 5v t 5 j o z 4 0 % q b d l b h f saves board space t ' j u t t p m e f s g p p u q s j o u p g industry standard 0402 (1005) devices t . p c j m f q i p o f t t 4 n b s u q i p o f t t 1 % " t t 1 p s u b c m f o b w j h b u j p o devices t % j h j u b m d b n f s b t t 1 p s u b c m f n f e j d b m e f w j d f t pinout 1 2 functional block diagram 1 2
24 ?2009 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products esd/surge protection devices SP1003 lead-free/green series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed. absolute maximum ratings symbol parameter value units i pp peak pulse current (t p 7. 0 a t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units forward voltage drop v f i f = 10ma 0.8 1.2 v reverse voltage drop v r i r =1ma 6.0 7.0 8.0 v reverse standoff voltage v rwm i r 1a 5.0 v reverse leakage current i leak v r =5v 1 a clamp voltage @ max i pp 1 v c t p =8/20s (iec61000-4-5) 12.5 v esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 25 kv iec61000-4-2 (air discharge) 30 kv diode capacitance 1 c d reverse bias=0v 30 pf note: 1 parameter is guaranteed by design and/or device characterization.
25 ?2009 littelfuse, inc. spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. esd/surge protection devices SP1003 lead-free/green series lead-free/green SP1003 pulse waveform capacitance vs. reverse bias clamping voltage vs. i pp 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 dc bias (v) capacitance (pf) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 1 2 3 4 5 6 7 peak pulse current-i pp (a) clamp voltage (v c ) 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0
26 ?2009 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products esd/surge protection devices SP1003 lead-free/green series application example re?ow condition 1 c o ' s f f b t t f n c m z pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) o t f d t average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) o t f d p o e t peak temperature (t p ) 250 +0/-5 c time within 5 c of actual peak temperature (t p ) o t f d p o e t ramp-down rate 6c/second max time 2 5 c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters shield ground signal ground i/o port controller low -speed port outside world (4) SP1003-01dtg b1 b2 b3 b4 shield ground signal ground i/o port controller low - speed port b1 b2 b3 b4 dx: SP1003-01dtg discrete diodes
27 ?2009 littelfuse, inc. spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. esd/surge protection devices SP1003 lead-free/green series lead-free/green SP1003 package dimensions - sod723 symbol sod723 millimeters inches min max min max a 0.46 0.51 0.018 0.020 b 0.23 0.28 0.009 0.011 c 0.08 0.13 0.003 0.005 d 0.99 1.04 0.039 0.041 e 0.58 0.64 0.023 0.025 he 1.37 1.47 0.054 0.058 l 0.15 0.25 0.006 0.010 l h e b c a e d recommended solder pad layout 1. 10 [0.043] 0.50 [0.020] 0.45 [0.018] millimeters (inches)
28 ?2009 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products esd/surge protection devices SP1003 lead-free/green series embossed carrier tape & reel speci?cation C sod723 symbol millimetres inches min max min max e 1.65 1.85 0.064 0.072 f 3.45 3.55 0.135 0.139 d1 0.45 0.55 0.017 0.021 d 150 - - 0.06 - - po 3.90 4.10 0.153 0.161 10po 40.0+/- 0.20 1.57+/-0.01 w 7.90 8.20 0.311 0.322 po 1.90 2.10 0.074 0.082 ao 0.63 0.73 0.024 0.028 a1 3 & ' 3 & ' bo 1.66 1.76 0.07 0.07 b1 3 & ' 3 & ' ko 0.54 0.64 0.021 0.025 t - - 0.21 - - 0.008 ko ao a1 ?d1 p ?d w e f bo b1 t po p2 ordering information part number package marking min. order qty. 4 1 % 5 ( sod723 c 8000 product characteristics lead plating 1 s f 1 m b u f e ' s b n f lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability 6 - 7 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. " m m t q f d j m d b u j p o t d p n q m z u p + & % & $ 4 1 & $ . 0 * t t v f " 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 1 b d l b h f t v s g b d f n b u u f m o j t i 7 % * part numbering system part marking system sp 1003 01 d t g silicon protection array series number of channels package d: sod723 t= tape & reel g= green c product series pin 1 indicator
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